发明申请
US20090058540A1 Microelectronic Die Having CMOS Ring Oscillator Thereon And Method of Using Same
有权
具有CMOS环形振荡器的微电子芯片及其使用方法
- 专利标题： Microelectronic Die Having CMOS Ring Oscillator Thereon And Method of Using Same
- 专利标题（中）： 具有CMOS环形振荡器的微电子芯片及其使用方法
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申请号： US11846190申请日： 2007-08-28
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公开(公告)号： US20090058540A1公开(公告)日： 2009-03-05
- 发明人: Gerald S. Leatherman , Jun He , Jose Maiz
- 申请人： Gerald S. Leatherman , Jun He , Jose Maiz
- 主分类号： H03K3/03
- IPC分类号： H03K3/03
摘要：
A microelectronic die including a CMOS ring oscillator thereon, and a method of using the same. The microelectronic die includes: a die substrate; and a plurality of CMOS ring oscillators on the die substrate, the ring oscillators being disposed at regions of the die substrate that are adapted to exhibit differing strain responses to package-induced stress with respect to one another.
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