Invention Application
- Patent Title: Print Processing for Patterned Conductor, Semiconductor and Dielectric Materials
- Patent Title (中): 图案导体,半导体和电介质材料的印刷加工
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Application No.: US12114741Application Date: 2008-05-02
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Publication No.: US20090065776A1Publication Date: 2009-03-12
- Inventor: Erik SCHER , Steven Molesa , Joerg Rockenberger , Arvind Kamath , Ikuo Mori
- Applicant: Erik SCHER , Steven Molesa , Joerg Rockenberger , Arvind Kamath , Ikuo Mori
- Main IPC: H01L29/04
- IPC: H01L29/04 ; C08L83/00 ; H01L29/06 ; H01L29/16 ; H01L21/208

Abstract:
Embodiments relate to printing features from an ink containing a material precursor. In some embodiments, the material includes an electrically active material, such as a semiconductor, a metal, or a combination thereof. In another embodiment, the material includes a dielectric. The embodiments provide improved printing process conditions that allow for more precise control of the shape, profile and dimensions of a printed line or other feature. The composition(s) and/or method(s) improve control of pinning by increasing the viscosity and mass loading of components in the ink. An exemplary method thus includes printing an ink comprising a material precursor and a solvent in a pattern on the substrate; precipitating the precursor in the pattern to form a pinning line; substantially evaporating the solvent to form a feature of the material precursor defined by the pinning line; and converting the material precursor to the patterned material.
Public/Granted literature
- US08530589B2 Print processing for patterned conductor, semiconductor and dielectric materials Public/Granted day:2013-09-10
Information query
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