发明申请
US20090065866A1 Non-Planar Silicon-On-Insulator Device that Includes an "Area-Efficient" Body Tie
有权
包含“区域高效”身体领带的非平面矽绝缘体设备
- 专利标题: Non-Planar Silicon-On-Insulator Device that Includes an "Area-Efficient" Body Tie
- 专利标题(中): 包含“区域高效”身体领带的非平面矽绝缘体设备
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申请号: US11853611申请日: 2007-09-11
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公开(公告)号: US20090065866A1公开(公告)日: 2009-03-12
- 发明人: Bradley J. Larsen , Michael S. Liu , Paul S. Fechner
- 申请人: Bradley J. Larsen , Michael S. Liu , Paul S. Fechner
- 申请人地址: US NJ Morristown
- 专利权人: Honeywell International Inc.
- 当前专利权人: Honeywell International Inc.
- 当前专利权人地址: US NJ Morristown
- 主分类号: H01L29/786
- IPC分类号: H01L29/786
摘要:
Non-planar SOI devices that include an “area-efficient” body tie are disclosed. The device includes a bulk substrate, an insulator layer formed on a surface of the bulk substrate, and a silicon body formed on a surface of the insulator layer. The silicon body preferably includes (i) a non-planar channel connecting a source region and a drain region, and (ii) a body tie that is adjacent to the channel and couples the channel to a voltage potential. The device further includes a gate dielectric formed on the channel and a gate material formed on the gate dielectric.