发明申请
- 专利标题： DUAL-SIDED CHIP ATTACHED MODULES
- 专利标题（中）： 双面芯片连接模块
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申请号： US12186655申请日： 2008-08-06
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公开(公告)号： US20090065925A1公开(公告)日： 2009-03-12
- 发明人: Kerry Bernstein , Timothy Dalton , Timothy Harrison Daubenspeck , Jeffrey Peter Gambino , Mark David Jaffe , Christopher David Muzzy , Wolfgang Sauter , Edmund Sprogis , Anthony Kendall Stamper
- 申请人： Kerry Bernstein , Timothy Dalton , Timothy Harrison Daubenspeck , Jeffrey Peter Gambino , Mark David Jaffe , Christopher David Muzzy , Wolfgang Sauter , Edmund Sprogis , Anthony Kendall Stamper
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
An electronic device and method of packaging an electronic device. The device including: a first substrate, a second substrate and an integrated circuit chip having a first side and an opposite second side, a first set of chip pads on the first side and a second set of chip pads on the second side of the integrated circuit chip, chip pads of the first set of chip pads physically and electrically connected to corresponding substrate pads on the first substrate and chip pads of the second set of chip pads physically and electrically connected to substrate pads of the substrate.
公开/授权文献
- US07863734B2 Dual-sided chip attached modules 公开/授权日：2011-01-04