An ink delivery arrangement includes a silicon substrate that defines a plurality of ink inlet channels. A CMOS drive circuitry layer is arranged on the silicon substrate. A plurality of nozzle arrangements is positioned on the silicon substrate to be in fluid communication with respective ink inlet channels. Each nozzle arrangement includes an annular nozzle wall about a respective ink inlet channel. A nozzle roof is on the nozzle wall so that the wall and roof define a nozzle chamber, the roof being movable with respect to the wall. A nozzle rim is defined by the nozzle roof so that ink can be ejected from the nozzle chamber when the roof is moved with respect to the wall. An electrically actuated beam is fast with the substrate to receive current from the drive circuitry layer and is connected to the nozzle roof to move the nozzle roof when actuated by the current.