发明申请
US20090067025A1 Method and System for Filling Voids in Electromechanical Systems
审中-公开
在机电系统中填充空隙的方法和系统
- 专利标题： Method and System for Filling Voids in Electromechanical Systems
- 专利标题（中）： 在机电系统中填充空隙的方法和系统
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申请号： US11852629申请日： 2007-09-10
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公开(公告)号： US20090067025A1公开(公告)日： 2009-03-12
- 发明人: Earl Vedere Atnip , Mark Andrew Franklin , Gregory Dean Winterton
- 申请人： Earl Vedere Atnip , Mark Andrew Franklin , Gregory Dean Winterton
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： US TX Dallas
- 主分类号： G02B26/08
- IPC分类号： G02B26/08 ; B05D5/06
摘要：
In accordance with one embodiment of the present disclosure, a method for filling a void of an electromechanical system includes forming a void within a support layer. A conductive layer is formed outwardly from the support layer such that a portion of the conductive layer partially fills the void. A remainder of the void is filled with an inorganic material. A mirror is formed outwardly from the inorganic material and the conductive layer.
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