发明申请
- 专利标题: Method and Apparatus for Plasma Processing
- 专利标题(中): 等离子体处理方法和装置
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申请号: US11887821申请日: 2006-04-04
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公开(公告)号: US20090068769A1公开(公告)日: 2009-03-12
- 发明人: Tomohiro Okumura , Yuichiro Sasaki , Katsumi Okashita , Hiroyuki Ito , Bunji Mizuno , Cheng-Guo Jin , Ichiro Nakayama
- 申请人: Tomohiro Okumura , Yuichiro Sasaki , Katsumi Okashita , Hiroyuki Ito , Bunji Mizuno , Cheng-Guo Jin , Ichiro Nakayama
- 优先权: JP2005-107775 20050404
- 国际申请: PCT/JP2006/307126 WO 20060404
- 主分类号: H01L21/66
- IPC分类号: H01L21/66 ; G21K5/00
摘要:
An object of the invention is to provide a method and an apparatus for plasma processing which can accurately monitor an ion current applied to the surface of a sample.Predetermined gas is exhausted via an exhaust port 11 by a turbo-molecular pump 3 while introducing the gas within the vacuum chamber 1 from a gas supply device 2, and the pressure within the vacuum chamber 1 is kept at a predetermined value by a pressure regulating valve 4. A high-frequency power supply 5 for a plasma source supplies a high-frequency power to a coil 8 provided near a dielectric window 7 to generate inductively coupled plasma within the vacuum chamber 1. A high-frequency power supply 10 for the sample electrode for supplying the high-frequency power to the sample electrode 6 is provided. A matching circuit 13 for the sample electrode and a high-frequency sensor 14 are provided between the sample electrode high-frequency power supply and the sample electrode 6. An ion current applied to the surface of a sample can be accurately monitored buy using the high-frequency sensor 14 and an arithmetic device 15.
公开/授权文献
- US07601619B2 Method and apparatus for plasma processing 公开/授权日:2009-10-13
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