发明申请
- 专利标题： Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device
- 专利标题（中）： 有机薄膜的化学机械抛光方法及制造半导体器件的方法
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申请号： US12289326申请日： 2008-10-24
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公开(公告)号： US20090068841A1公开(公告)日： 2009-03-12
- 发明人: Yukiteru Matsui , Gaku Minamihaba , Yoshikuni Tateyama , Hiroyuki Yano , Atsushi Shigeta
- 申请人： Yukiteru Matsui , Gaku Minamihaba , Yoshikuni Tateyama , Hiroyuki Yano , Atsushi Shigeta
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 优先权： JP2003-157154 20030602; JP2004-076408 20040317
- 主分类号： H01L21/304
- IPC分类号： H01L21/304
摘要：
There is disclosed a chemical mechanical polishing method of an organic film comprising forming the organic film above a semiconductor substrate, contacting the organic film formed above the semiconductor substrate with a polishing pad attached to a turntable, and dropping a slurry onto the polishing pad to polish the organic film, the slurry being selected from the group consisting of a first slurry and a second slurry, the first slurry comprising a resin particle having a functional group selected from the group consisting of an anionic functional group, a cationic functional group, an amphoteric functional group and a nonionic functional group, and having a primary particle diameter ranging from 0.05 to 5 μm, the first slurry having a pH ranging from 2 to 8, and the second slurry comprising a resin particle having a primary particle diameter ranging from 0.05 to 5 μm, and a surfactant having a hydrophilic moiety.