发明申请
- 专利标题: Electromagnetic bandgap structure and printed circuit board including multi-via
- 专利标题(中): 电磁带隙结构和印刷电路板,包括多通孔
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申请号: US12076650申请日: 2008-03-20
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公开(公告)号: US20090071709A1公开(公告)日: 2009-03-19
- 发明人: Mi-Ja Han , Han Kim , Ja-Bo Koo
- 申请人: Mi-Ja Han , Han Kim , Ja-Bo Koo
- 申请人地址: KR Suwon
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2007-0094919 20070918
- 主分类号: H05K1/02
- IPC分类号: H05K1/02
摘要:
An electromagnetic bandgap structure and a printed circuit board that intercepts to transfer a signal having a predetermined frequency band are disclosed. In particularly, the electromagnetic bandgap structure includes a first metal layer and a second metal layer; a metal plate, placed between the first metal layer and a second metal layer; a multi-via, penetrating the first metal layer, passing through the same planar surface as an outer metal layer and turning toward the first metal layer to connect the metal plate and the first metal layer; and a dielectric layer, stacked in between the first metal layer and the metal plate, between the metal plate and the second metal layer and between the first metal layer and the outer metal layer. With the present invention, a bandgap frequency can be decreased without increasing the size of the metal plate.
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