发明申请
US20090072207A1 FLAME RETARDANT RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD USING THE SAME AND MANUFACTURING METHOD THEREOF
审中-公开
用于印刷电路板的阻燃树脂组合物，使用该印刷电路板的印刷电路板及其制造方法
- 专利标题： FLAME RETARDANT RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD USING THE SAME AND MANUFACTURING METHOD THEREOF
- 专利标题（中）： 用于印刷电路板的阻燃树脂组合物，使用该印刷电路板的印刷电路板及其制造方法
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申请号： US11937038申请日： 2007-11-08
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公开(公告)号： US20090072207A1公开(公告)日： 2009-03-19
- 发明人: Jae-Choon CHO , Jun-Rok Oh , Keun-Yong Lee , Sang-Moon Lee
- 申请人： Jae-Choon CHO , Jun-Rok Oh , Keun-Yong Lee , Sang-Moon Lee
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 优先权： KR10-2007-0092874 20070913
- 主分类号： C09K21/00
- IPC分类号： C09K21/00 ; B29C65/00
摘要：
The present invention relates to a flame retardant resin composition for a printed circuit board and a printed circuit board using the same, in more detail, to a flame retardant resin composition which includes a complex epoxy resin, photo acid generator, a curing agent, a curing accelerator, and an inorganic filler, so that UV curable and property-maintainable insulating material can be manufactured, and to a printed circuit board using the same.The flame retardant resin composition according to the present invention contains a photo acid generator instead of an acrylate reactive diluent which is included UV curable insulating material so that fine patterned printed circuit board can be manufactured through UV curing and post thermal curing.
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