发明申请
US20090072368A1 PACKAGE FOR MONOLITHIC COMPOUND SEMICONDUCTOR (CSC) DEVICES FOR DC TO DC CONVERTERS
有权
用于直流到直流转换器的单片化合物半导体（CSC）器件的封装
- 专利标题： PACKAGE FOR MONOLITHIC COMPOUND SEMICONDUCTOR (CSC) DEVICES FOR DC TO DC CONVERTERS
- 专利标题（中）： 用于直流到直流转换器的单片化合物半导体（CSC）器件的封装
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申请号： US12184547申请日： 2008-08-01
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公开(公告)号： US20090072368A1公开(公告)日： 2009-03-19
- 发明人: Kunzhong Hu , Chuan Cheah , Bo Yang
- 申请人： Kunzhong Hu , Chuan Cheah , Bo Yang
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A multichip module defining a dc to dc converter employs a monolithic chip containing at least two III-nitride switches (a monolithic CSC chip) mounted on a conductive lead frame. The CSC chip is copacked with an IC driver for the switches and with the necessary passives. The module defines a buck converter; a boost converter, a buck boost converter, a forward converter and a flyback converter. The drain, source and gate pads of the monolithic CSC chip are connected to a lead frame by solder or epoxy or by bumping attach and a conductive connector or wire bonds connect the switch terminal to lead frame.
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