发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DELAMINATION PREVENTION STRUCTURE
- 专利标题（中）： 具有分层预防结构的集成电路封装系统
-
申请号： US11857206申请日： 2007-09-18
-
公开(公告)号： US20090072377A1公开(公告)日： 2009-03-19
- 发明人: DongSam Park , A Leam Choi , Keon Teak Kang
- 申请人： DongSam Park , A Leam Choi , Keon Teak Kang
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
An integrated circuit package system includes: mounting an integrated circuit die over a carrier; attaching a delamination prevention structure over the integrated circuit die; and encapsulating the delamination prevention structure and the integrated circuit die.