发明申请
- 专利标题： High-bandwidth interconnect network for an integrated circuit
- 专利标题（中）： 用于集成电路的高带宽互连网络
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申请号： US11901182申请日： 2007-09-14
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公开(公告)号： US20090073967A1公开(公告)日： 2009-03-19
- 发明人: Dana How , Godfrey P. D'Souza , Malcolm J. Wing , Colin N. Murphy , Arun Jangity
- 申请人： Dana How , Godfrey P. D'Souza , Malcolm J. Wing , Colin N. Murphy , Arun Jangity
- 专利权人： CSWITCH CORPORATION
- 当前专利权人： CSWITCH CORPORATION
- 主分类号： H04L12/50
- IPC分类号： H04L12/50
摘要：
A bus structure providing pipelined busing of data between logic circuits and special-purpose circuits of an integrated circuit, the bus structure including a network of pipelined conductors, and connectors selectively joining the pipelined conductors between the special-purpose circuits, other pipelined connectors, and the logic circuits.
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