发明申请
- 专利标题: Stackable splice chip device
- 专利标题(中): 可堆叠拼接芯片器件
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申请号: US12231313申请日: 2008-08-29
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公开(公告)号: US20090074371A1公开(公告)日: 2009-03-19
- 发明人: Yilmaz Bayazit , Mark Smrha , Oscar Bran De Leon , Tom Tinucci
- 申请人: Yilmaz Bayazit , Mark Smrha , Oscar Bran De Leon , Tom Tinucci
- 申请人地址: US MN Eden Prairie
- 专利权人: ADC Telecommunications, Inc.
- 当前专利权人: ADC Telecommunications, Inc.
- 当前专利权人地址: US MN Eden Prairie
- 主分类号: G02B6/00
- IPC分类号: G02B6/00
摘要:
A splice tray arrangement including a tray and a splice chip arrangement. The splice chip arrangement including stackable splice chips defining channels for holding splice elements. Each of the splice chips including a mounting arrangement for mounting the splice chip at a mounting location on the tray, and a stacking arrangement for mounting the splice chip upon another splice chip.
公开/授权文献
- US07764858B2 Stackable splice chip device 公开/授权日:2010-07-27
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