Invention Application
US20090079341A1 BACKPLANE STRUCTURES FOR SOLUTION PROCESSED ELECTRONIC DEVICES
审中-公开
解决方案处理电子设备的背板结构
- Patent Title: BACKPLANE STRUCTURES FOR SOLUTION PROCESSED ELECTRONIC DEVICES
- Patent Title (中): 解决方案处理电子设备的背板结构
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Application No.: US12237496Application Date: 2008-09-25
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Publication No.: US20090079341A1Publication Date: 2009-03-26
- Inventor: YAW-MING A. TSAI
- Applicant: YAW-MING A. TSAI
- Main IPC: H01J1/63
- IPC: H01J1/63 ; H01J9/00 ; H01L29/04
Abstract:
There is provided a backplane for an organic electronic device. The backplane has a TFT substrate; a thick organic planarization layer; a multiplicity of electrode structures; and a thin insulative inorganic bank structure defining a multiplicity of pixel openings on the electrode structures.
Information query
