发明申请
- 专利标题： Semiconductor chips having improved electrostatic discharge protection circuit arrangement
- 专利标题（中）： 具有改善的静电放电保护电路布置的半导体芯片
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申请号： US12292026申请日： 2008-11-10
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公开(公告)号： US20090080129A1公开(公告)日： 2009-03-26
- 发明人: Ki-Tae Lee , Han-Gu Kim , Jae-Hyok Ko
- 申请人： Ki-Tae Lee , Han-Gu Kim , Jae-Hyok Ko
- 优先权： KR10-2006-0009389 20060131
- 主分类号： H02H9/00
- IPC分类号： H02H9/00 ; H01L23/62
摘要：
A semiconductor chip may include a plurality of pads arranged in at least a first and a second row, and a plurality of protection circuits connected to the plurality of pads. The plurality of protection circuits may include at least one diode. A first protection circuit may be connected to a first pad in the first row of pads, and a second protection circuit may be connected to a second pad in the second row of pads. The first and second protection circuits may be arranged under the first row of pads.
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