发明申请
- 专利标题： HEAT SINK AND COOLING UNIT USING THE SAME
- 专利标题（中）： 使用相同的散热器和冷却单元
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申请号： US11718272申请日： 2006-01-11
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公开(公告)号： US20090080159A1公开(公告)日： 2009-03-26
- 发明人: Shigetoshi Ippoushi , Akira Yamada , Takeshi Tanaka , Akihiro Murahashi , Kazuyoshi Toya , Hideo Okayama
- 申请人： Shigetoshi Ippoushi , Akira Yamada , Takeshi Tanaka , Akihiro Murahashi , Kazuyoshi Toya , Hideo Okayama
- 申请人地址： JP Tokyo
- 专利权人： MITSUBISHI DENKI KABUSHIKI KAISHA
- 当前专利权人： MITSUBISHI DENKI KABUSHIKI KAISHA
- 当前专利权人地址： JP Tokyo
- 优先权： JP2005-007975 20050114
- 国际申请： PCT/JP2006/300208 WO 20060111
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A heat sink including a compact cooling system, superior uniformity of heating, provides a compact cooling unit superior in uniformity of cooling. A heat sink includes a header for distribution connected to a cooling fluid inlet, a header for confluence connected to a cooling fluid outlet and parallel to and adjacent to the header for distribution and a heat transfer vessel including a heating element mounting surface as well as channels inside. The channels are connected to the header for distribution and the header for confluence.
公开/授权文献
- US08225854B2 Heat sink and cooling unit using the same 公开/授权日：2012-07-24