Invention Application
- Patent Title: WATERPROOF MODULE FOR LED LAMP
- Patent Title (中): LED灯泡防水模块
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Application No.: US11952639Application Date: 2007-12-07
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Publication No.: US20090080201A1Publication Date: 2009-03-26
- Inventor: Jiahn-Chang WU
- Applicant: Jiahn-Chang WU
- Priority: TW096135495 20070921
- Main IPC: F21V15/01
- IPC: F21V15/01

Abstract:
A waterproof ring unit is located in the opening of a socket. A ring ditch is made around the inner surface of the waterproof ring unit. When a flanged light emitting diode (LED) lamp is inserted into the socket, the ring ditch structurally couples to the flange. The waterproof ring embraces the lamp body to form a waterproof module for the LED lamp.
Public/Granted literature
- US07887229B2 Waterproof module for LED lamp Public/Granted day:2011-02-15
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