Invention Application
US20090080201A1 WATERPROOF MODULE FOR LED LAMP 有权
LED灯泡防水模块

  • Patent Title: WATERPROOF MODULE FOR LED LAMP
  • Patent Title (中): LED灯泡防水模块
  • Application No.: US11952639
    Application Date: 2007-12-07
  • Publication No.: US20090080201A1
    Publication Date: 2009-03-26
  • Inventor: Jiahn-Chang WU
  • Applicant: Jiahn-Chang WU
  • Priority: TW096135495 20070921
  • Main IPC: F21V15/01
  • IPC: F21V15/01
WATERPROOF MODULE FOR LED LAMP
Abstract:
A waterproof ring unit is located in the opening of a socket. A ring ditch is made around the inner surface of the waterproof ring unit. When a flanged light emitting diode (LED) lamp is inserted into the socket, the ring ditch structurally couples to the flange. The waterproof ring embraces the lamp body to form a waterproof module for the LED lamp.
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