发明申请
- 专利标题： Flexible Laminate Board, Process for Manufacturing of the Board, and Flexible Print Wiring Board
- 专利标题（中）： 柔性层压板，板的制造工艺和柔性印刷接线板
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申请号： US12091519申请日： 2006-10-19
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公开(公告)号： US20090081426A1公开(公告)日： 2009-03-26
- 发明人: Masahiko Suzuki , Kazuhito Obata , Katsuyuki Masuda , Kenichi Tomioka , Masaki Takeuchi , Sumio Yoshida , Hirokazu Suzuki , Yoshisugu Matsuura
- 申请人： Masahiko Suzuki , Kazuhito Obata , Katsuyuki Masuda , Kenichi Tomioka , Masaki Takeuchi , Sumio Yoshida , Hirokazu Suzuki , Yoshisugu Matsuura
- 优先权： JP2005-310184 20051025; JP2005-353800 20051207
- 国际申请： PCT/JP2006/320851 WO 20061019
- 主分类号： B32B3/10
- IPC分类号： B32B3/10 ; B32B15/08 ; B05D3/02 ; B05D3/10
摘要：
A process for production of a flexible laminated sheet having one or more laminated bodies each provided with a metal foil formed on one side of a resin film, the process comprising a coating step in which a varnish containing a polyamic acid and a solvent is coated onto the metal foil to form a coated film, a holding step in which the coated film formed on the metal foil is held, a drying step in which at least a portion of the solvent in the varnish is removed to form a layer composed of a resin composition, and a resin film-forming step in which the layer composed of the resin composition is heated to form a resin film containing a polyimide resin. The conditions for each step from the coating step up to the resin film-forming step are adjusted based on a target for the content of metal elements in the resin film.
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