发明申请
- 专利标题： FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD
- 专利标题（中）： 卷芯片安装体和片芯安装方法
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申请号： US11914581申请日： 2006-05-09
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公开(公告)号： US20090085227A1公开(公告)日： 2009-04-02
- 发明人: Tsukasa Shiraishi , Seiichi Nakatani , Seiji Karashima , Koichi Hirano , Takashi Kitae , Yoshihisa Yamashita , Takashi Ichiryu
- 申请人： Tsukasa Shiraishi , Seiichi Nakatani , Seiji Karashima , Koichi Hirano , Takashi Kitae , Yoshihisa Yamashita , Takashi Ichiryu
- 申请人地址： JP Osaka
- 专利权人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人地址： JP Osaka
- 优先权： JP2005-143745 20050517; JP2005-144887 20050518
- 国际申请： PCT/JP2006/309339 WO 20060509
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L21/60
摘要：
A flip chip mounting body in which a circuit substrate having a plurality of connection terminals and an electronic part (semiconductor chip) having a plurality of electrode terminals are aligned face to face with each other, with a resin composition composed of solder powder, a resin and a convection additive being sandwiched in between, while a means such as spacers is interposed in between so as to provide a uniform gap between the two parts, or the electronic part (semiconductor chip) is placed inside a plate-shaped member having two or more protruding portions, so that the solder powder is allowed to move through boiling of the convection additive and to be self-aggregated to form a solder layer, thereby electrically connecting the connection terminals and the electrode terminals; and a mounting method for such a mounting body.