An in-mould molding touch module includes a transparent conducting substrate and a molding rind. The transparent conducting substrate has an inner surface and an outer surface. The inner surface has a capacitive electrode layer formed thereon. The capacitive electrode layer is a touch sense circuit made of ITO, and the outer surface is configured for touching the touch sense circuit. The molding rind is integrated to contain a periphery of the transparent conducting substrate by an in-mould injecting mode.