发明申请
- 专利标题： PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
- 专利标题（中）： 印刷线路板及其制造方法
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申请号： US12146165申请日： 2008-06-25
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公开(公告)号： US20090090003A1公开(公告)日： 2009-04-09
- 发明人: Honchin En , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
- 申请人： Honchin En , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
- 申请人地址： JP Ogaki-shi
- 专利权人： IBIDEN CO., LTD
- 当前专利权人： IBIDEN CO., LTD
- 当前专利权人地址： JP Ogaki-shi
- 优先权： JP10-272799 19980928; JP10-276010 19980929; JP10-276011 19980929; JP10-290450 19981013; JP10-310445 19981030; JP10-351572 19981210; JP10-354733 19981214; JP10-372274 19981228; JP11-106184 19990414; JP11-187418 19990701
- 主分类号： H05K3/00
- IPC分类号： H05K3/00
摘要：
The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
公开/授权文献
- US08020291B2 Method of manufacturing a printed wiring board 公开/授权日：2011-09-20
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