发明申请
- 专利标题： Semiconductor Device
- 专利标题（中）： 半导体器件
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申请号： US12234771申请日： 2008-09-22
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公开(公告)号： US20090091892A1公开(公告)日： 2009-04-09
- 发明人: Takukazu Otsuka , Keiji Okumura , Masao Saito
- 申请人： Takukazu Otsuka , Keiji Okumura , Masao Saito
- 申请人地址： JP Kyoto-fu
- 专利权人： Rohm Co., Ltd.
- 当前专利权人： Rohm Co., Ltd.
- 当前专利权人地址： JP Kyoto-fu
- 优先权： JP2007-249491 20070926; JP2008-021890 20080131
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed on a plane intersecting with a plane having the first output unit disposed thereon; and a controller configured to control the output units.
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