Invention Application
US20090092273A1 Silicon microphone with enhanced impact proof structure using bonding wires
有权
硅胶麦克风具有增强的防撞结构,采用接合线
- Patent Title: Silicon microphone with enhanced impact proof structure using bonding wires
- Patent Title (中): 硅胶麦克风具有增强的防撞结构,采用接合线
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Application No.: US11973075Application Date: 2007-10-05
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Publication No.: US20090092273A1Publication Date: 2009-04-09
- Inventor: Wang Zhe , Chong Ser Choong
- Applicant: Wang Zhe , Chong Ser Choong
- Assignee: Silicon Matrix Pte. Ltd.
- Current Assignee: Silicon Matrix Pte. Ltd.
- Main IPC: H04R9/08
- IPC: H04R9/08

Abstract:
A backplateless silicon microphone and a wire protection method for improved impact resistance are disclosed. A circular diaphragm is surrounded by a circular spring having a plurality of slots and perforations to facilitate air damping reduction, release of in-plane stress, and improve out-plane flexibility. Anchored at a substrate, the circular spring holds the silicon microphone suspended over a backside hole in the substrate but allows the diaphragm to vibrate perpendicular to the substrate. A microphone variable capacitor is formed between the perforated spring and substrate. Slot size is minimized to prevent particles from entering an underlying air gap. A plurality of “n” bonding pads near the outer edge of the circular spring are connected by “n/2” bonding wires that serve as a stopper to restrict an upward motion of the diaphragm. The bonding wires may cross each other to enable lower loop height for more effective resistance to impact.
Public/Granted literature
- US08045733B2 Silicon microphone with enhanced impact proof structure using bonding wires Public/Granted day:2011-10-25
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