发明申请
- 专利标题： LIGHT EMITTING DIODE PACKAGE
- 专利标题（中）： 发光二极管封装
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申请号： US12332678申请日： 2008-12-11
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公开(公告)号： US20090095975A1公开(公告)日： 2009-04-16
- 发明人: Sang Hyun SHIN , Seog Moon Choi , Young Ki Lee , Yong Sik Kim
- 申请人： Sang Hyun SHIN , Seog Moon Choi , Young Ki Lee , Yong Sik Kim
- 申请人地址： KR Gyunggi-Do
- 专利权人： SUMSUNG ELECTO-MECHANICS CO., LTD.
- 当前专利权人： SUMSUNG ELECTO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Gyunggi-Do
- 优先权： KR10-2006-0022141 20060309
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
A light emitting diode package for preventing an electric short circuit among semiconductor layers and with excellent bonding strength. The light emitting diode package includes a package substrate, a light emitting diode chip bonded to an upper surface of the package substrate, and a bonding material for bonding the light emitting diode chip to the package substrate. The package substrate has a recess formed in a bonding surface thereof to accommodate the bonding material.
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