This is a ceramic disk PTC and heater assembly, and a method for attaching one to the other, the combination useful in the heating elements of solid ink printing apparatus. The ceramic disk PTC attachment method is made up of a low melting temperature solder and a high operating temperature adhesive. The solder attaches the disk to a substrate, and provides a low resistance electrical and thermal bond to the substrate. The adhesive is used to substantially completely encircle the solder, containing the solder when melted, and keeping the PTC attached when the solder is melted. The adhesive can also partially encircle the solder to a degree sufficient to substantially prevent substantial escape of molten solder from the attachment area.