发明申请
- 专利标题： Heat dissipation device and electronic device with the same
- 专利标题（中）： 散热装置与电子装置相同
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申请号： US11953714申请日： 2007-12-10
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公开(公告)号： US20090103264A1公开(公告)日： 2009-04-23
- 发明人: Jui-Wen Hung , Ching-Bai Hwang
- 申请人： Jui-Wen Hung , Ching-Bai Hwang
- 申请人地址： TW Tu-Cheng
- 专利权人： Foxconn Technology Co., Ltd.
- 当前专利权人： Foxconn Technology Co., Ltd.
- 当前专利权人地址： TW Tu-Cheng
- 优先权： CN200710123989.5 20071019
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A heat dissipation device includes a fan (200), a first wire collection structure (280) and a second wire collection structure (290). The fan (200) includes a frame (210) and an impeller (240) disposed in the frame (210). The first wire collection structure (280) is formed on the frame (210) to collect wires (270) of the fan (200). The second wire collection structure (290) is formed on the frame (210) and configured for collecting wires (460) of another component other than the fan (200).
公开/授权文献
- US07613000B2 Heat dissipation device and electronic device with the same 公开/授权日：2009-11-03
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