发明申请
US20090103350A1 Method of Testing an Integrated Circuit, Method of Manufacturing an Integrated Circuit, and Integrated Circuit 审中-公开
集成电路测试方法,制造集成电路的方法和集成电路

  • 专利标题: Method of Testing an Integrated Circuit, Method of Manufacturing an Integrated Circuit, and Integrated Circuit
  • 专利标题(中): 集成电路测试方法,制造集成电路的方法和集成电路
  • 申请号: US11874768
    申请日: 2007-10-18
  • 公开(公告)号: US20090103350A1
    公开(公告)日: 2009-04-23
  • 发明人: Michael Kund
  • 申请人: Michael Kund
  • 主分类号: G11C11/00
  • IPC分类号: G11C11/00 G11C29/00 H01L21/66
Method of Testing an Integrated Circuit, Method of Manufacturing an Integrated Circuit, and Integrated Circuit
摘要:
According to one embodiment of the present invention, a method of testing a memory device including a memory cell array is provided, the method including: dividing the memory cell array into a plurality of memory cell array subunits, each memory cell array subunit including a plurality of resistivity changing memory cells; simultaneously testing all resistivity changing memory cells of a memory cell array subunit using a common testing signal; and repeating the testing for all further memory cell array subunits.
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