An apparatus 1 for packaging a sensor device comprises a main body 2 having an internal chamber 4 with a base 2b on which, in use, is mounted the sensor so as to couple the sensor to the strain field in an article to which the packaging is attached by means of said base. A lid 3 is separately formed from and is formed of a different material to said base 2b and is sealable to the main body 2 in order to seal close said internal aperture 4. The lid 3 includes contact pins 8, 9 which extend therethrough from one side to the other. A first end 8a, 8b of each said pin 8, 9 extends into said chamber 4 when the lid 3 is positioned on the body 2 for connection to said sensor and a second end 8b, 9b of each said pin 8, 9 extends away from the package when the lid 3 is positioned on the body 2 for connection to a rotary coupler.