发明申请
- 专利标题： SEALED SUBSTRATE CARRIERS AND SYSTEMS AND METHODS FOR TRANSPORTING
- 专利标题（中）： 密封基板载体和系统以及运输方法
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申请号： US12257376申请日： 2008-10-23
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公开(公告)号： US20090110518A1公开(公告)日： 2009-04-30
- 发明人: Michael Robert Rice , Jeffrey C. Hudgens
- 申请人： Michael Robert Rice , Jeffrey C. Hudgens
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L21/677
- IPC分类号： H01L21/677
摘要：
An electronic device manufacturing system is disclosed. The system includes a processing tool having one or more processing chambers each adapted to perform an electronic device manufacturing process on one or more substrates; a substrate carrier adapted to couple to the system and carry one or more substrates; and a component adapted to create a sealed environment relative to at least a portion of the substrate carrier and to substantially equalize the sealed environment with an environment within the substrate carrier. Methods of the invention are described as are numerous other aspects.