A sheet sticking table 13 used for sticking an adhesive sheet S onto the upper surface of a semiconductor wafer W is provided. The sheet sticking table 13 comprises an outer table 51 and an inner table 52. The outer table 51 and inner table 52 are provided movably in the vertical direction via uniaxial robots 54, 56 respectively, and the inner table 52 is provided movably together with the outer table 51 in the vertical direction when the outer table 51 is moved in the vertical direction.