发明申请
US20090121240A1 Nitride Semiconductor Device and Method for Manufacturing the Same
审中-公开
氮化物半导体器件及其制造方法
- 专利标题: Nitride Semiconductor Device and Method for Manufacturing the Same
- 专利标题(中): 氮化物半导体器件及其制造方法
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申请号: US12083836申请日: 2006-10-19
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公开(公告)号: US20090121240A1公开(公告)日: 2009-05-14
- 发明人: Yukio Shakuda , Masayuki Sonobe , Norikazu Ito
- 申请人: Yukio Shakuda , Masayuki Sonobe , Norikazu Ito
- 申请人地址: JP KYOTO-SHI
- 专利权人: ROHM CO., LTD
- 当前专利权人: ROHM CO., LTD
- 当前专利权人地址: JP KYOTO-SHI
- 优先权: JP2005-305596 20051020
- 国际申请: PCT/JP2006/320842 WO 20061019
- 主分类号: H01L33/00
- IPC分类号: H01L33/00 ; H01L29/205 ; H01L21/205
摘要:
There is provided a nitride semiconductor device with low leakage current and high efficiency in which, while a zinc oxide based compound such as MgxZn1-xO (0≦x≦0.5) is used for a substrate, crystallinity of nitride semiconductor grown thereon is improved and film separation or cracks are prevented. The nitride semiconductor device is formed by laminating nitride semiconductor layers on a substrate (1) made of a zinc oxide based compound such as MgxZn1-xO (0≦x≦0.5). The nitride semiconductor layers include a first nitride semiconductor layer (2) made of AlyGa1-yN (0.05≦y≦0.2) which is provided in contact with the substrate (1), and nitride semiconductor layers (3) to (5) laminated on the first nitride semiconductor layer (2) so as to form a semiconductor element.
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