发明申请
- 专利标题： LEAD FRAME STRUCTURE AND APPLICATIONS THEREOF
- 专利标题（中）： 引导框架结构及其应用
-
申请号： US12167622申请日： 2008-07-03
-
公开(公告)号： US20090121329A1公开(公告)日： 2009-05-14
- 发明人: Chia-Yu Chen , Ta-Lin Pong , En-Shou Chang , I-Chi Cheng , Chen-Ping Su
- 申请人： Chia-Yu Chen , Ta-Lin Pong , En-Shou Chang , I-Chi Cheng , Chen-Ping Su
- 优先权： TW96142746 20071112
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H05K7/18
摘要：
A lead frame structure comprises a side rail, a first paddle, a second paddle, a plurality of leads, and an downset anchor bar. The first paddle is connected to the side rail via at least one first tie bar, and the second paddle is connected to the side rail via at least one-second tie bar. The first paddle and the second paddle separated from each other are used to define an area to support a chip. These leads set on the side rail expends toward to the chip supporting area. One end of the downset anchor bar is connected to the side rail, and the other end of the downset anchor bar has a protrusion portion which is between the first paddle and the second paddle and is downset from the side rail.
公开/授权文献
- US07576418B2 Lead frame structure and applications thereof 公开/授权日：2009-08-18
信息查询
IPC分类:
