发明申请
- 专利标题: Method and Apparatus to Reduce Impedance Discontinuity in Packages
- 专利标题(中): 减少封装阻抗不连续性的方法和装置
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申请号: US11942061申请日: 2007-11-19
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公开(公告)号: US20090126983A1公开(公告)日: 2009-05-21
- 发明人: Paul M. Harvey , Douglas O. Powell , Wolfgang Sauter , Yaping Zhou
- 申请人: Paul M. Harvey , Douglas O. Powell , Wolfgang Sauter , Yaping Zhou
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H05K3/10
摘要:
A method, system and apparatus for coating plated through holes (PTHs) to reduce impedance discontinuity in electronic packages. PTH vias are imbedded in the core of a printed circuit board comprising a core layer, a plurality of buildup layers, a plurality of micro-vias, and a plurality of traces. Traces electrically interconnect each of the micro-vias to PTH vias, forming an electrically conductive path. PTHs are coated with a magnetic metal material, such as nickel, to increase the internal and external conductance of the PTHs, thereby providing decreased impedance discontinuity of the signals in electronic packages.