发明申请
- 专利标题: Probe structure
- 专利标题(中): 探头结构
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申请号: US12318977申请日: 2009-01-14
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公开(公告)号: US20090129435A1公开(公告)日: 2009-05-21
- 发明人: Kevin Lin , Vincent Weng , Joy Liao
- 申请人: Kevin Lin , Vincent Weng , Joy Liao
- 主分类号: G01J5/04
- IPC分类号: G01J5/04 ; G01J5/00
摘要:
The present invention discloses an improved probe structure, which is installed in the body of an infrared clinical thermometer and comprises a plastic hollow casing having an opening; a curved block annularly arranged inside the opening; a hollow sleeve arranged inside the casing and along the perimeter of the opening; a temperature sensor arranged inside sleeve and below the curved block; a support element arranged inside the sleeve and supporting the temperature sensor; and a thermal insulation ring encircling the temperature sensor and pressing against the inner wall of the sleeve. The thermal insulation ring has an outer diameter larger than a width of the temperature sensor, and an air gap is thus formed between the temperature sensor and the inner wall of the sleeve; the top of the thermal insulation ring has an altitude higher than the top of the temperature sensor, and another air gap is thus formed between the temperature sensor and the curved block. Thereby is effectively retarded heat conduction from the external to the temperature sensor.
公开/授权文献
- US07988352B2 Probe structure 公开/授权日:2011-08-02
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