The present invention provides an adhesive pad comprising a fibrous layer comprising a mixture of metal fibers and polymeric fibers, said fibrous layer having a thickness of at least 3 mm and having on at least one of its opposite major surfaces an adhesive layer, said adhesive layer being configured so as to allow electrical contact between said fibrous layer and a metal substrate when such metal substrate is adhered to said adhesive layer. The opposite major surfaces of the fibrous layer of the adhesive pad are generally planar and generally parallel to each other. In a particular embodiment, the adhesive pad is in the form of a sheet, for example rectangular, square, circular or oval or in the form of a web.