A vacuum film forming apparatus includes a target chamber in which a target is disposed for performing a vacuum film forming; a first mold at a side of the target chamber; and a second mold that includes a workpiece chamber in which a workpiece is capable of being disposed. The first mold and the second mold are structured such that a film being formed onto the workpiece is capable of being carried out by die matching between the first mold and the second mold, and a shutter device for opening and closing the target chamber is provided to the first mold.