发明申请
US20090136748A1 Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methods
审中-公开
用于半导体组件中的芯片接合的粘合剂组合物，由其制备的粘合剂膜，由其制备的切割芯片接合膜，包括其的器件封装以及相关方法
- 专利标题： Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methods
- 专利标题（中）： 用于半导体组件中的芯片接合的粘合剂组合物，由其制备的粘合剂膜，由其制备的切割芯片接合膜，包括其的器件封装以及相关方法
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申请号： US12292874申请日： 2008-11-28
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公开(公告)号： US20090136748A1公开(公告)日： 2009-05-28
- 发明人: Han Nim Choi , Ki Tae Song , Chi Seok Hwang , Hea Kyung Kim , Chang Beom Chung
- 申请人： Han Nim Choi , Ki Tae Song , Chi Seok Hwang , Hea Kyung Kim , Chang Beom Chung
- 优先权： KR10-2007-0122101 20071128
- 主分类号： B32B33/00
- IPC分类号： B32B33/00
摘要：
An adhesive film composition includes a polymer binder; a curable resin; and about 40 to about 60 wt. % of solvent, wherein the solvent is a binary solvent consisting essentially of at least a first solvent with a boiling point of about 40° C. to about 100° C. and at least a second solvent with a boiling point of about 140° C. to about 200° C.
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