发明申请
- 专利标题： HEAT SINK DEVICE
- 专利标题（中）： 散热装置
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申请号： US11910460申请日： 2006-04-06
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公开(公告)号： US20090139704A1公开(公告)日： 2009-06-04
- 发明人: Kota Otoshi , Eiji Kono , Hidehito Kubo , Masahiko Kimbara , Yuichi Furukawa , Shinobu Yamauchi , Ryoichi Hoshino , Nobuhiro Wakabayashi , Shintaro Nakagawa
- 申请人： Kota Otoshi , Eiji Kono , Hidehito Kubo , Masahiko Kimbara , Yuichi Furukawa , Shinobu Yamauchi , Ryoichi Hoshino , Nobuhiro Wakabayashi , Shintaro Nakagawa
- 申请人地址： JP Aichi-ken JP Minato-ku Tokyo
- 专利权人： Kabushiki Kaisha Toyota Jidoshokki,Showa Denko K.K.
- 当前专利权人： Kabushiki Kaisha Toyota Jidoshokki,Showa Denko K.K.
- 当前专利权人地址： JP Aichi-ken JP Minato-ku Tokyo
- 优先权： JP2005110175 20050406
- 国际申请： PCT/JP2006/307307 WO 20060406
- 主分类号： F28F7/00
- IPC分类号： F28F7/00
摘要：
A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on a side of the insulating substrate 3 opposite the heat-generating-element-mounting side. A stress relaxation member 4 intervenes between the metal layer 7 of the insulating substrate 3 and the heat sink 5. The stress relaxation member 4 is formed of an aluminum plate 10 having a plurality of through holes 9 formed therein, and the through holes 9 serve as stress-absorbing spaces. The stress relaxation member 4 is brazed to the metal layer 7 of the insulating substrate 3 and to the heat sink 5. This heat radiator 1 is low in material cost and exhibits excellent heat radiation performance.