发明申请
US20090140405A1 SEMICONDUCTOR DEVICE AND RESIN ADHESIVE USED TO MANUFACTURE THE SAME
审中-公开
半导体器件和用于制造其的树脂粘合剂
- 专利标题： SEMICONDUCTOR DEVICE AND RESIN ADHESIVE USED TO MANUFACTURE THE SAME
- 专利标题（中）： 半导体器件和用于制造其的树脂粘合剂
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申请号： US12210490申请日： 2008-09-15
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公开(公告)号： US20090140405A1公开(公告)日： 2009-06-04
- 发明人: Tetsumasa Maruo , Masanori Minamio , Kiyokazu Itoi
- 申请人： Tetsumasa Maruo , Masanori Minamio , Kiyokazu Itoi
- 优先权： JP2007-311926 20071203
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
A semiconductor device includes: a semiconductor element; a package body having the semiconductor element bonded inside thereof and electrically connected to the semiconductor element; a lid-like member covering the semiconductor element, and bonded to the package body to form a hollow structure; and a bonding member for bonding the package body and the lid-like member to each other. The bonding member is a resin adhesive containing an epoxy resin, a polymerization initiator, and a filling material, and a content of the filling material in the bonding member is 30 wt % to 60 wt %.
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