发明申请
US20090140411A1 RESIN-SEALED SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, BASE MATERIAL FOR THE SEMICONDUCTOR DEVICE, AND LAYERED AND RESIN-SEALED SEMICONDUCTOR DEVICE
有权
树脂密封半导体器件，其制造方法，半导体器件的基底材料，以及层状和树脂密封半导体器件
- 专利标题： RESIN-SEALED SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, BASE MATERIAL FOR THE SEMICONDUCTOR DEVICE, AND LAYERED AND RESIN-SEALED SEMICONDUCTOR DEVICE
- 专利标题（中）： 树脂密封半导体器件，其制造方法，半导体器件的基底材料，以及层状和树脂密封半导体器件
-
申请号： US12302113申请日： 2007-06-22
-
公开(公告)号： US20090140411A1公开(公告)日： 2009-06-04
- 发明人: Masachika Masuda , Chikao Ikenaga , Koji Tomita
- 申请人： Masachika Masuda , Chikao Ikenaga , Koji Tomita
- 申请人地址： JP Shinjuku-Ku
- 专利权人： Dai Nappon Printing Co., Ltd
- 当前专利权人： Dai Nappon Printing Co., Ltd
- 当前专利权人地址： JP Shinjuku-Ku
- 优先权： JP2006-173032 20060622
- 国际申请： PCT/JP2007/062582 WO 20070622
- 主分类号： H01L23/29
- IPC分类号： H01L23/29 ; H01L21/56 ; H01L23/48
摘要：
The present invention provides a resin-sealed semiconductor device, which includes a semiconductor element; a plurality of terminal members, each surrounding the semiconductor element and including an external terminal portion, an internal terminal portion and a connecting portion; bonding wires, each connecting the semiconductor element with the internal terminal portion; and a resin-sealing portion sealing the semiconductor element, terminal members and bonding wires. Each terminal member is composed of an inner thinned portion forming the internal terminal portion and an outer thickened portion forming the external terminal portion. A rear face of each internal terminal portion, and a front face, a rear face and an outer side face of each external terminal portion are exposed to the outside from the resin-sealing portion, respectively.
公开/授权文献
信息查询
IPC分类:
