发明申请
- 专利标题: ALIGNMENT FOR BACKSIDE ILLUMINATION SENSOR
- 专利标题(中): 背面照明传感器对准
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申请号: US11951916申请日: 2007-12-06
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公开(公告)号: US20090146325A1公开(公告)日: 2009-06-11
- 发明人: Jen-Cheng Liu , Dun-Nian Yaung , Shou-Gwo Wuu
- 申请人: Jen-Cheng Liu , Dun-Nian Yaung , Shou-Gwo Wuu
- 申请人地址: TW Hsin-Chu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsin-Chu
- 主分类号: H01L23/544
- IPC分类号: H01L23/544 ; H01L21/46
摘要:
An apparatus and manufacturing method thereof, wherein an integrated circuit is located in a first region of a substrate having first and second opposing major surfaces, and wherein an alignment mark is located in a second region of the substrate and extends through the substrate between the first and second surfaces. The alignment mark may protrude from the first and/or second surfaces, and/or may comprise a plurality of substantially similar alignment marks. The second region may interpose the first region and a perimeter of the substrate. The second region may comprise a scribe region.
公开/授权文献
- US07588993B2 Alignment for backside illumination sensor 公开/授权日:2009-09-15