A cavity filter device includes a micro-strip structure comprising a low dielectric organic material forming a printed wiring board. The printed wiring board may be soldered, welded, or adhered to the base of one or more cavity filters. The cavity filter may include a coupling pin such as a RF pin positioned at the base of the filter. The micro-strip structure may be configured to carry a RF signal from the input, across the micro-strip structure to the RF pin positioned at the base of the filter.