发明申请
US20090148967A1 METHODS OF MAKING AND USING INTEGRATED AND TESTABLE SENSOR ARRAY
有权
制造和使用集成和可测传感器阵列的方法
- 专利标题： METHODS OF MAKING AND USING INTEGRATED AND TESTABLE SENSOR ARRAY
- 专利标题（中）： 制造和使用集成和可测传感器阵列的方法
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申请号： US11951360申请日： 2007-12-06
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公开(公告)号： US20090148967A1公开(公告)日： 2009-06-11
- 发明人: Robert Gideon Wodnicki , Stacey Joy Kennerly , Wei-Cheng Tian , Kevin Matthew Durocher , David Martin Mills , Charles Gerard Woychik , Lowell Scott Smith
- 申请人： Robert Gideon Wodnicki , Stacey Joy Kennerly , Wei-Cheng Tian , Kevin Matthew Durocher , David Martin Mills , Charles Gerard Woychik , Lowell Scott Smith
- 申请人地址： US NY Schenectady
- 专利权人： GENERAL ELECTRIC COMPANY
- 当前专利权人： GENERAL ELECTRIC COMPANY
- 当前专利权人地址： US NY Schenectady
- 主分类号： H01L21/66
- IPC分类号： H01L21/66
摘要：
A method for making a testable sensor assembly is provided. The method includes forming a first sensor array on a first substrate having a first side and a second side, wherein the first sensor array is formed on the first side of the first substrate, coupling a first semiconductor wafer having a first side and a second side to the first sensor array, wherein the first side of the first semiconductor wafer is coupled to the first sensor array, thinning one of the second side of the first substrate or the second side of the first semiconductor wafer, and testing the first sensor array to identify operational and non-operational units in the testable sensor assembly before integration of the sensor assembly with interface electronics.