发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERCONNECT LOCK
- 专利标题（中）： 具有互连锁定的集成电路封装系统
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申请号： US11954607申请日： 2007-12-12
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公开(公告)号： US20090152706A1公开(公告)日： 2009-06-18
- 发明人: Heap Hoe Kuan , Seng Guan Chow , Linda Pei Ee Chua , Dioscoro A. Merilo
- 申请人： Heap Hoe Kuan , Seng Guan Chow , Linda Pei Ee Chua , Dioscoro A. Merilo
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/56
摘要：
An integrated circuit package system includes: mounting a device structure over a package carrier; connecting an internal interconnect between the device structure and the package carrier; forming an interconnect lock over the internal interconnect over the device structure with interconnect lock exposing the device structure; and forming a package encapsulation adjacent to the interconnect lock and over the package carrier.
公开/授权文献
- US07985628B2 Integrated circuit package system with interconnect lock 公开/授权日：2011-07-26
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