发明申请
US20090159210A1 Roll-to-roll substrate transfer apparatus, wet etching apparatus comprising the same and apparatus for manufacturing printed circuit board
有权
卷对卷基板输送装置,包含该蚀刻装置的湿式蚀刻装置以及印刷电路板的制造装置
- 专利标题: Roll-to-roll substrate transfer apparatus, wet etching apparatus comprising the same and apparatus for manufacturing printed circuit board
- 专利标题(中): 卷对卷基板输送装置,包含该蚀刻装置的湿式蚀刻装置以及印刷电路板的制造装置
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申请号: US12317562申请日: 2008-12-23
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公开(公告)号: US20090159210A1公开(公告)日: 2009-06-25
- 发明人: Deok-heung Kim
- 申请人: Deok-heung Kim
- 申请人地址: KR Changwon-city
- 专利权人: Samsung Techwin Co., Ltd.
- 当前专利权人: Samsung Techwin Co., Ltd.
- 当前专利权人地址: KR Changwon-city
- 优先权: KR10-2007-0136376 20071224
- 主分类号: C23F1/00
- IPC分类号: C23F1/00 ; B65G13/02
摘要:
In one aspect, a roll-to-roll substrate transfer apparatus is provided that includes: a feed roll and a take-up roll between which a printed circuit board substrate extends; and a plurality of drive roller rows transmitting motive power to the substrate for moving the substrate in a transferring direction, each drive roller row of the plurality includes a roller axis arranged in a direction perpendicular to the transferring direction of the substrate, and a plurality of spaced-apart drive rollers on the roller axis, wherein drive rollers of one drive roller row are arranged in spaces between drive rollers of adjacent drive roller rows. In other aspects, a wet etching apparatus and an apparatus for manufacturing a printed circuit board that include the roll-to-roll substrate transfer apparatus are provided.
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