发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFINGER SUPPORT
- 专利标题（中）： 集成电路封装系统与引导支持
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申请号： US12410463申请日： 2009-03-25
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公开(公告)号： US20090179314A1公开(公告)日： 2009-07-16
- 发明人: Henry D. Bathan , Zigmund Ramirez Camacho , Arnel Trasporto , Jeffrey D. Punzalan
- 申请人： Henry D. Bathan , Zigmund Ramirez Camacho , Arnel Trasporto , Jeffrey D. Punzalan
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
An integrated circuit package system including forming a leadframe having a lead with a leadfinger support of a predetermined height, and attaching an integrated circuit die with an electrical interconnect at a predetermined collapse height determined by the predetermined height of the leadfinger support.
公开/授权文献
- US08022514B2 Integrated circuit package system with leadfinger support 公开/授权日：2011-09-20
信息查询
IPC分类:
