发明申请
- 专利标题： SOLDER CONTACTS AND METHODS OF FORMING SAME
- 专利标题（中）： 焊接接头及其形成方法
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申请号： US11972793申请日： 2008-01-11
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公开(公告)号： US20090179333A1公开(公告)日： 2009-07-16
- 发明人: Alfred Martin , Barbara Hasler , Martin Franosch , Klaus-Guenter Oppermann
- 申请人： Alfred Martin , Barbara Hasler , Martin Franosch , Klaus-Guenter Oppermann
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/44
摘要：
An integrated circuit that comprises a substrate and a structured layer on the substrate. The structured layer comprises an opening to the substrate, a first field and a second field on the substrate, wherein the first field and the second field, at least in part, overlap with the opening. The integrated circuit further comprises a first material in the area of the first field and a second material in the area of the second field. The first material impedes a wetting by a solder material, and the second provides a wetting by the solder material.
公开/授权文献
- US07745321B2 Solder contacts and methods of forming same 公开/授权日：2010-06-29
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