发明申请
- 专利标题： REDUCING INTRODUCTION OF FOREIGN MATERIAL TO WAFERS
- 专利标题（中）： 减少外来材料引进外墙
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申请号： US11972118申请日： 2008-01-10
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公开(公告)号： US20090180848A1公开(公告)日： 2009-07-16
- 发明人: David J. Clark , Alison K. Easton , James E. Fluegel , James H. Peterman
- 申请人： David J. Clark , Alison K. Easton , James E. Fluegel , James H. Peterman
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L21/673
- IPC分类号： H01L21/673
摘要：
A system and method of reducing the introduction of foreign material to wafers. A system includes an enclosure structured and arranged to carry wafers used in semiconductor device manufacturing, and an attractive material arranged as at least a portion of an interior surface of the enclosure.
公开/授权文献
- US07901490B2 Reducing introduction of foreign material to wafers 公开/授权日：2011-03-08
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