发明申请
US20090181490A1 IMAGE SENSING DEVICES AND METHODS FOR FABRICATING THE SAME 有权
图像感测装置及其制造方法

IMAGE SENSING DEVICES AND METHODS FOR FABRICATING THE SAME
摘要:
Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device comprises a first substrate having a first side and a second side opposing each other. A plurality of image sensing elements is formed in the first substrate at the first side. A conductive via is formed through the first substrate, having a first surface exposed by the first substrate at the first side and a second surface exposed by the first substrate at the second side. A conductive pad overlies the conductive via at the first side and is electrically connecting the image sensing elements. A conductive layer overlies the conductive via at the second side and electrically connects with the conductive pad. A conductive bump is formed over a portion of the conductive layer. A second substrate is bonded with the first substrate at the first side.
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